Digital gaming Signage Industries

Touchscreen Technology

o Resistive Touch Screen Technology

o The cost effective workhorse of touch technologies

o Surface Acoustic Wave (SAW) Touch Screen Technology

o Superior optical characteristics for best clarity

o Capacitive Touch Screen Technology

o Durable, cost effective solution, impervious to on-screen contaminants

o Infrared Touch Screen Technology

o Suitable for harsh environments and outdoor applications

o Large touch screens for digital signage

refer to: http://industrial-embedded.com/news/ais-gaming-digital-signage-industries/

The open source software movement has forever transformed the mobile device landscape

The speed of innovation in automotive IVI is making a lot of heads turn. No question, Linux OS and Android are the engines for change.

The open source software movement has forever transformed the mobile device landscape. Consumers are able to do things today that 10 years ago were unimaginable. Just when smartphone and tablet users are comfortable using their devices in their daily lives, another industry is about to be transformed. The technology enabled by open source in this industry might be even more impressive than what we’ve just experienced in the smartphone industry.

The industry is automotive, and already open source software has made significant inroads in how both driver and passenger interact within the automobile. Open source stalwarts Linuxand Google are making significant contributions not only in the user/driver experience, but also in safety-critical operations, vehicle-to-vehicle communications, and automobile-to-cloud interactions.

Initially, automotive OEMs turned to open source to keep costs down and open up the supply chain. In the past, Tier 1 suppliers and developers of In-Vehicle Infotainment (IVI) systems would treat an infotainment center as a “black box,” comprised mostly of proprietary software components and dedicated hardware. The OEM was not allowed to probe inside, and had no ability to “mix and match” the component parts. The results were sometimes subquality systems in which the automotive OEM had no say, and no ability to maintain. With the advent of open source, developers are now not only empowered to cut software development costs, but they also have control of the IVI system they want to design for a specified niche. Open source software, primarily Linux and to some extent Android, comprises open and “free” software operating platforms or systems. What makes Linux so special are the many communities of dedicated developers around the world constantly updating the Linux kernel. While there are many Linux versions, owned by a range of open source communities and commercial organizations, Android is owned and managed exclusively by Google.

Linux has further opened up the possibilities with safety-critical operations and multimedia communications. Hardware companies have followed suit with more IVI functions built onto a single piece of silicon, improving security and performance.

The available power of multicoreSoC hardware hosting a Linux operating system is fueling rapid expansion in vehicle software in the area of telematics. In Europe, for example, by 2015, all new cars must be equipped with the eCall system, to automatically alert emergency services in the event of a collision. Services such as insurance tracking, stolen vehicle notification, real-time cloud data (traffic, weather, road conditions ahead), car-to-car communication, driverless car, diagnostics, and servicing are also made available via in-car Internet services. To operate in this space, IVI hardware needs to have multicore processor support, GPU/high-performance graphics with multiple video outputs, Internet connectivity, and compatibility with existing in-car networks such as CAN, MOST, and AVB. Several components are already on the market, and the future potential is exciting.

Consolidating multiple functions into a single Linux-based Electronic Control Unit (ECU) allows for a reduction in component count, thereby reducing overall vehicle costs. Maintenance becomes easier. And the wire harness costs are reduced as the total ECU count drops. As Linux becomes more widespread in vehicles, additional technologies will consolidate – for example, instrument clusters and AUTOSAR-based ECUs may coexist with infotainment stacks. It’s also important to realize that the complexity of software and the amount of software code used will only increase as these new technologies become standard. Already more than 100 million lines of code are used in the infotainment system of the S-Class Mercedes-Benz and according to Linuxinsider.com, and that number is projected to triple by 2015 (Figure 1).

Figure 1: Software complexity in IVI systems continues to grow. Today, the IVI system of an S-Class Mercedes has 100m lines of code. By 2015, it is expected to be 300m. A Linux-based solution, capable of scaling to handle the complexity, is mandatory.

Android apps hit the road

The Android operating system, on the other hand, was designed from the start to support mobile devices and has proved that it can serve more than mobile phones. Using the Android OS for in-vehicle entertainment provides all the entertainment features offered by a top-of-the-range, in-dash infotainment system with the addition of informative, driver-assisting content including hands-free calling, multimedia center, and a navigation system/Google maps. For an open source expandable system (whereby the framework can be extended and applications can be developed for it), the Android OS can be enhanced to support multiple audio and video feeds. For example, IVI audio requirements include music, phone calls, sensor warnings, and navigation announcements, which must be managed and prioritized. Managing multiple displays, with an information-focus for the driver and entertainment-focus for passengers, is also a requirement. The UI for the driver should be arranged to minimize distraction, while passengers will want as much content as possible from their UIs. But many automotive OEMs and developers ask, “Why not just use the Android smartphone and tie it into a vehicle’s dash?” Not only would this be more cost effective for the developer, but the user would have instant familiarity with the system.

One organization promoting the use of the smartphone as an IVI in-dash system is the Car Connectivity Consortium (CCC). The CCC provides standards and recipe books for tethering a smartphone to the infotainment head unit. The CCC members implement MirrorLink (Figure 2), a technology standard for controlling a nearby smartphone from the in-car infotainment system screen or via dashboard buttons and controls. This allows familiar smartphone-hosted applications and functions to be easily accessed. CCC members include more than 80 percent of the world’s automakers, and more than 70 percent of global smartphone manufacturers. The MirrorLink technology is compatible with Mentor Embedded’s GENIVI 3.0 specification Linux base platform solution.

Figure 2: An example of smartphone in-dash tethering: Drivers use the same smartphone apps in the vehicle as they do on their own smartphone, which provides a great deal of familiarity.

A recent example of smartphone tethering can be found in certain subcompact models from U.S. auto manufacturer General Motors. Select Chevrolet models carry the “MyLink” in-dash infotainment system.

From both a cost and ease-of-use perspective, tethering a smartphone makes a lot of sense. But there’s another reason to consider. Some automotive manufacturers are nervous about being too dependent on Google – as Google is the sole provider and owner of the Android mobile platform. Android built into an IVI system is an 8- to 10-year commitment, and a lot can happen in that time regarding license fees or terms of use.

Linux and Android driving together?

Despite the strengths of and differences between these two popular platforms, recent embedded architecture developments now allow the Linux and Android operating systems to happily coexist. And this might be a very good thing. For example, Android can be hosted on top of Linux using Linux Container Architecture (LXC) (Figure 3). The resources, access control, and security of the Android client are managed by the host Linux operating system. For system designers concerned about the security of Android, this represents a good way to offer Android app access, and keep other system functions on a standard Linux platform. Multicore System-on-Chip (SoC) platforms make this architecture even more attractive, as there are sufficient resources for both Linux and Android domains to perform well simultaneously. The CPU resources can be shared, along with memory, graphics processing resources, and other peripherals. The output of the two domains can be recombined into a common Human Machine Interface (HMI) allowing the user to select functions from both domains.

Figure 3: There are several ways to include Android (Android apps) in a Linux-based IVI solution. One method, which is becoming increasingly more popular, is using Linux Container Architecture. Here, Android sits as a guest OS on top of the Linux kernel. Privileges and permissions are tightly controlled.

Exciting times ahead

Both Linux and Android are extremely versatile and powerful operating systems worthy of consideration in IVI systems. We are still in the infancy stages in what these two open source platforms can do for IVI. Now is the perfect time to starting developing or to join a consortium so that you too can reap the fruits of what IVI promises down the road.

refer:http://embedded-computing.com/articles/automotive-source-drives-innovation/

How to approach to communication processors...

Generic multicore processors have been promoted as the solution to networking communication processing. In reality, they can’t address the scalability, determinism, and ease of programming required for next-generation networking infrastructure. An asymmetric multicore approach that blends multicore processors with networking-optimized accelerator engines and C-programmable libraries meets the challenges of next-generation networks.
Achieving deterministic performance is a key requirement for network operators to ensure reliability across wide variations of traffic profiles and applications. Multicore processors can meet performance challenges when running an application on a single, dual-core, or quad-core processor. However, when scaling to eight cores or beyond, performance scaling usually degrades. There are cases where eight cores deliver no better performance than four, and 16 cores actually run slower than eight.
Networking applications tend to be data-intensive, and generic multicore processors are highly susceptible to the impacts of memory latency on performance. The nonlinearities of memory latency (Figure 1) with regard to memory load combined with the nonlinearities of processor performance relative to memory latency can lead to unpredictable and unreliable performance. The innovative approach taken by LSI to solving this problem is asymmetrical multicore processors, which combine general-purpose processors with specialized accelerators for particular data-intensive tasks, resulting in an optimal, scalable solution.

Asymmetrical multicore processors improve performance predictability by combining general-purpose processors and accelerators to address the nonlinearities of memory latency.

Networking infrastructure applications tend to involve complex processing, intense memory utilization, and real-time, deterministic requirements. Asymmetric architectures address these challenges by seamlessly allocating the work between general-purpose multicore processors and specialized acceleration engines. These accelerators are specifically designed to tolerate memory latencies and perform predictably. This approach also enables the application to be built using fewer general-purpose multicore processors with far fewer lines of code. The asymmetric approach simplifies scaling challenges and delivers more deterministic performance at lower cost and power.
Networking applications demand a flexible approach to OSs. This flexibility is required not only to meet application requirements, but also to support the smooth migration of OEM legacy software and give designers the ability to choose the right OS for a particular application. It is important to simultaneously support multiple OSs on different cores without introducing overhead. At LSI, our hardware and software has been architected from the ground up with all this in mind, providing flexible support for the range of OSs used in networking applications.
refer: http://embedded-computing.com/articles/an-multicore-done-right244/

Driven by electronics

High-end electronics provide drivers and passengers with in-car navigation and entertainment and information delivered over a wireless network. In fact, many car buyers today care more about the infotainment technologies embedded in the dashboard than what's under the hood. This phenomenon is requiring additional storage space for rich multimedia data and advanced software and applications and is driving an explosive growth of both volatile and nonvolatile memories. Embedded multimedia cards are helping meet this demand in today's memory-hungry automotives.

Automotive electronics are memory hungry
The explosive growth of infotainment systems in modern cars has a significant impact on the market demand for semiconductor memories. For 2012, the average memory content of a car was estimated to be around US$12.8, ranging from US$2.0 for low-end models to more than US$100 for fully equipped luxury vehicles. As a result, the total available market value for semiconductor memories in automotive applications is expected to reach a Compounded Annual Growth Rate (CAGR) of more than 9 percent from 2011 to 2015, well above the overall CAGR for the total memory semiconductor market, which is less than 7 percent.
Managed NAND: Ideal solution for car infotainment
New memory solutions, specifically tailored for automotive infotainment systems, are needed to provide additional storage space for rich infotainment multimedia data and advanced software and applications. An example is the embedded multimedia card device, a nonvolatile memory option (Figure 1). It has all the features needed to support navigation and infotainment applications such as detailed 3D maps, traffic monitoring, meteorological information, car radioand multimedia, e-call, and voice recognition. Embedded multimedia card memory is a standardized version of the “managed NAND” memory architecture. It is essentially a module based on a bank of nonvolatile NAND flash devices and is internally managed by an ad hocmicrocontroller (Figure 2).

Figure 1: Close-up of an embedded multimedia card device: top side view with bonding wires. The package contains everything needed to fully manage the memory independently from the NAND technology inside.

Figure 2: Schematic diagram of a traditional NAND memory compared to a managed NAND chip that already integrates intelligent functions and an ad hoc microcontroller for easier interface with the host processor.

The primary advantage to the user is that an embedded multimedia card’s memory is fully managed and independent from the NAND technology inside. As NAND flash geometries shrink, the technology becomes more complex to manage in terms of dealing with increased Error Correction Code (ECC) requirements, wear leveling, and bad block management. NAND flash is also variable in terms of road-map changes that require updates to software and perhaps even at the controller level.
Embedded multimedia card memory is backward compatible and has a standard interface so that changes to the NAND are transparent to the application. This means that developers don’t have to bother with dedicated software to manage the complexity of NAND flash. Embedded multimedia card memory uses standard interfaces, and functions are geared to match JEDEC specifications.
Micron Technology, for example, provides a wide range of densities of its Embedded MultiMedia Card (e•MMC), 4 GB to 64 GB, with an integrated 16-bit NAND controller that offers more robust management and memory optimization compared to discrete NAND devices. An evolution toward 256 GB modules has already been defined. The next step will be the development of higher-density managed NAND memory solutions like Solid State Drive (SSD) modules and higher-performance 32-bit microcontrollers. All of Micron’s e•MMC devices are available in JEDEC-standard 100-ball, 1 mm pitch and 153-ball/169-ball, 0.5 mm pitch BGA packages, easing the design and validation process that is critical to the fast pace of product development in the automotive segment.
An answer to automotive application needs
Quality is an important factor for the rapidly innovative in-vehicle infotainment electronics market, and memory is the backbone of this segment where semiconductor products must meet specific automotive-grade certifications. Accordingly, embedded multimedia cards have special features to meet automotive requirements, such as dedicated test pads for failure analysis. The NAND devices inside these modules can be accessed without going through the controller, enabling a full and comprehensive check of the memory bank.
e•MMC devices are fully operational at -40 °C to +85 °C so that data written into the memory at the lowest end of the temperature range is still valid when read at peak temperature, and vice versa. Power-loss protection is another advantage. And in the final analysis, embedded multimedia cards help enable a rich infotainment experience – and a safe ride – for driver and passengers.


You can visit:
http://www.acrosser.com/Products/In-Vehicle-Computer.html
Refer:
http://embedded-computing.com/articles/automotive-industry-innovation-driven-electronics/

Modular standards extend ARM platform

The competitive market for smart, connected devices is heating up, which requires OEMs to stay focused on differentiating their products and getting to market quickly. ARM-based building blocks are enabling OEMs to reallocate the resources needed to find, install, program, and troubleshoot drivers or debug hardware and concentrate instead on their core competencies. With prevalidated platforms that are fully configured and tested to deliver the required interoperability, compatibility, and functionality, OEMs can focus on application development and reuse existing application-specific software on a flexible hardware framework.

ARM addresses smart, connected application requirements
The requirements of today’s smart tablet and HMI tool applications extend beyond technology and power specifications to include rugged, extended life-cycle product support. These applications are typically portable systems that challenge embedded designers with space constraints and require fully sealed fanless enclosures that must operate reliably over extended periods. Designers have struggled to make existing standards and higher power consumption processor architectures work in these applications, and thus have anticipated the introduction of more focused products specifically designed to support ARM-based subsystems.
Similar to other popular CPU architectures, the ARM architecture offers an open-systems approach. ARM-based platforms provide excellent performance-per-watt ratios with very low power consumption at less than 1 W operating power, as well as CPU performance that is comparable to or exceeds what is offered in the latest low-power x86 or RISC-based processors. ARM processors deliver the performance needed to power an easy-to-use Graphical User Interface (GUI) for mobile smartphones and tablets and also support extended-temperature operation. When ARM’s up to 15-year platform longevity is added to the list of benefits, it is easy to see that these processors meet most smart, connected embedded application demands. However, in the past, a key element to success was missing – new embedded technology standards needed to be established to help drive continued innovation and swift platform adoption.
Global support for ARM platform standards
A new vendor-independent standards organization called the Standardization Group for Embedded Technologies (SGET) was organized to help speed the development of standardized hardware and software for embedded computing. To keep pace with market demands and the dynamic pace of technology, SGET has set simplified rules and shorter objection periods so that specifications can be passed much faster.
The first working group formed under SGET has defined the Ultra-Low-Power Computer-On-Module (ULP-COM) standard aimed at supporting ultra-low-power applications using System-on-Chip (SoC) devices. Figure 1 shows an example of a ULP-COM platform. The ULP-COM specification is characterized by its extremely flat form factor dimensions and its optimized pinoutfor SoC processors. The ULP-COM standard specifies a 314-pin connector with a height of just 4.3 mm (the MXM 3.0). This connection method satisfies mobile design requirements for very low-profile, robust, and cost-effective modules. For additional design flexibility, two different module sizes are specified – a short module measuring 82 mm x 50 mm and a full-size module measuring 82 mm x 80 mm.

 

Standardization brings interface support benefits
Before ULP-COM, all existing module specifications were primarily based on x86 technology and its associated chipsets that support a multitude interfaces such as USB, PCI Express, and PCI Express graphics ports geared to PC design. ARM, on the other hand, supports more traditional embedded ports such as UART, I2C, I2S, and SDIO.
The ULP-COM standard addresses the need for dedicated interfaces supported by the latest ARM processors, which makes it notably different from the COM Express standard (see Figure 2). ULP-COM adds features that are not typically found on COM Express, such as the cost-effective parallel TFT display bus and MIPI display interface. It includes support for multiple SPI links and SDIO interfaces, which are needed for consumer camera and phone memory cards. ULP-COM also supports LVDS, HDMI, and embedded DisplayPort for future designs.

 

ULP-COM gives designers the standardized feature set specifically matched to ARM I/O. This feature set brings to light the importance software plays in enabling board compatibility and interchangeability and demonstrates why it has become a crucial system design decision now more than ever.
The value of a building block approach
ARM-based devices have been successfully implemented in many embedded systems. However, most of these existing systems offer limited interoperability and lack a clear, scalable design path. Furthermore, products that supported ARM in the past typically required more in-depth development, as the software was tied directly to both the hardware and the specific application, making them more proprietary in nature. That meant that any new design basically had to start from scratch. It was obvious that flexible building blocks were necessary to support the demands of evolving market applications.
This is where platform suppliers with experience bringing standardized form factors such as COM, Mini-ITX motherboards, and Pico-ITX embedded SBCs to market can benefit OEMs. It is this know-how for creating standardized modules that will create ARM-based platform building blocks that OEMs can leverage to secure system longevity and smooth migration from generation to generation. While ARM processors will never completely replace x86 or RISC processors in embedded systems, ARM-based computing platforms can be used as optimized building blocks for certain applications and market segments that are presently underserved.
Steps taken ensure easy adoption and long-term viability
Designers have realized that ARM processor-based platforms are ideal for low-profile, high-densityembedded devices such as tablets, smartphones, and HMI tools. ARM satisfies these application requirements with long product life – a minimum of 7 years and up to 15 years – with processors that are small in size and height and do not require a chipset. With no moving parts, simplified passive cooling and thermal management are achieved to eliminate points of failure for higher system reliability.
A strong ecosystem of hardware and software providers is currently overcoming the continuity of support issues associated with implementing ARM. The availability of standards-based platforms such as the new ULP-COM makes it easier for designers to implement and speed the development of ARM-based products. ULP-COM platforms deliver the desired performance-to-power ratios needed for portable and fully enclosed systems and offer an array of flexible display options for the full range of deployment needs.
Above all, the ULP-COM platforms gives OEMs a prevalidated building block approach that helps ease integration, reduce design risk, and shorten the time from development to deployment of smart, connected devices. The ability to reuse these known building blocks provides the needed interoperability and evolutionary design path embedded systems OEMs demand while also securing technology investments. Suppliers are taking these steps with the goal of making it easier for OEMs to adopt new modules so that ARM’s long-term viability and development benefits will be available for many years to come.
 Refer:
http://embedded-computing.com/articles/modular-scalability-smart-connected-devices/#at_pco=cfd-1.0

Fanless thermal design AIV-HM76V0FL

 

AIV-HM76V0FL features Intel HM76 mobile chipset and FCPGA 988 socket for 3rd generation Core i mobile computer platform. AIV-HM76V0FL adopts Acrosser’s expertise of design for in-vehicle applications. These designs include smart power management, high efficient thermal module, and diversity of integrated communication technology such as 4 USB 3.0, CAN bus, Wi-Fi, 3.5G wireless WAN, Bluetooth and GPS.

The smart power management subsystem enables user to define the power on and off sequences through software interface or BIOS setting to meet any requirement of in-vehicle applications.

AIV-HM76V0FL Features
‧ FCPGA 988 socket support Intel 3rd Generation Core i7/i5 and Celeron processors up to 45W i7-3820QM
‧ Fanless thermal design and anti-vibration industrial design
‧ HDMI/DVI/VGA video outputs
‧ Combo connector for Acrosser’s In-Vehicle monitor
‧ 4 external USB 3.0 ports
‧ CAN bus 2.0 A/B
‧ Wi-Fi, Bluetooth, 3.5G, GPS
‧ One-wire (i-Button) interface
‧ 9-32 VDC power input
‧ -20 to 60 degree C operating temperature

Acrosser also integrated two useful features to the AIV-HM76V0Fl as AR-V6100. The one-wire (i-Button) interface provides system integrators a low cost solution for driver ID, temperature and humidity sensors. And the combo connector combines VGA, audio, USB and DC 12V power output all in one connector so significantly simplify the harness between the AIV-HM76V0FL and Acrosser’s in-vehicle touch monitors.

Smart power management, high efficient thermal module, and diversity of integrated communication technology

Both Acrosser In-Vehicle PC, AR-V6100 & AR-V6005 have been selected as the winner of 21th Taiwan Excellence Award. This award delivered by the Ministry of Economic Affairs (MOEA) and Taiwan External Trade Development Council (TAITRA), to encourage Taiwan industries to upgrade and incorporate innovations into their new products.

All of above functions are controlled by software that can be customized based on ODM customers’ requirement. To execute the 24/7 mission-critical applications on the road, AR-V6100 & AR-V6005 are two of the best solutions for you.